Deposition, Growth and Annealing systems
Dielectric Sputter System
Electron Beam Evaporation (Aluminum)
Electroplating System
AMAT ENDURA PVD system
Four-target Electron Beam Evaporator
Furnaces 2
AMAT Gate Stack Centura
Thermal Evaporator
Hot Wire CVD (HWCVD)
Inductively coupled plasma CVD (ICPCVD)
Metal Sputtering System (NORDIKO)
Plasma Immersion Ion Implantation (PIII)
Pulsed LASER Deposition (PLD)
Polymer evaporation system
Rapid Thermal Processing (RTP)
Silanization Set-up
Thermal Evaporation System (Chrome-Gold)
Ultech Furnaces
Thermal Evaporator INDIUM Deposition
Six Target E Beam Evaporator For Metal Deposition
Molecular Beam Epitaxy III-V
Electrical characterization
Fully Shielded Probe Station with Triax Chuck
Fully Shielded ProbeStation with Triax Thermo Chuck
Fully Shielded ProbeStation with Triax Thermo Chuck
Mercury Probe
Unshielded Probestation with BNC chuck
Unshielded Probe Station with Thermo Chuck
Unshielded ProbeStation with Thermo Chuck
Temperature dependent Magneto-Electric Experimental Setup
FPA Characterization
Photoluminsescence Measurement Setup
Hall measurement system
Material and structural characterization
Atomic Force Microscope (AFM)
Spectroscopic Ellipsometry
Flurescene (research) Microscope
Contact Angle Measurement
Olympus Industrial Microscope
Potentiostat
Scanning Electrochemical Microscope (SECM)
Spectrum 100 Optica FT-IR System
Surface Profilometer
Four Probe system
UV-VIS-NIR spectrophotometer
Deep-level transient spectroscopy(DLTS)
Spectral Response Measurement
Dry Process Dicing
Reactive Ion Etch
AMAT Etch Centura
Inductively Coupled Plasma RIE (ICPRIE) System
STS RIE 320 PC
Lithography
Double Side Aligner-EVG 620
JOEL SEM 6400 with Lithography Attachment
MJB-3 mask aligner
LASER Writer
Raith 150 - Lithography
Bonding tools
Wafer Bonder
Wire Bonder
FC150 Flip Chip Bonder
Logitech PM5 Precision Lapping and Polishing Machine
Logitech WSB2 Wafer Substrate Bonding Unit
Miscellaneous
Miscellaneous
Wet benches
