EE765:RELIABILITY AND FAILURE ANALYSIS OF ELECTRONIC DEVICES
1. Background and Introduction: Definitions of reliability, failure modes,
mechanisms, cost of warranty returns, motivation for improving product
reliability in the era of ‘Planned Obsolescence’.
2. Introduction to mathematical methods for reliability: Failure rates,
Normal distribution function, Six Sigma, Exponential, Weibull and
Lognormal distributions for reliability modeling. Manufacturing yields.
3. Accelerated testing: Types of accelerated tests, Designing accelerated
tests for typical stressors experienced in field, Acceleration factors,
Arrhenius, Eyring and modified Coffin-Manson models.
4. Introduction to semiconductor device packaging: Materials and processes
used for semiconductor device packaging, stresses induced because of
5. Physics of failure based models for : Mass transport-induced failures
(electromiration and stress voiding), Electronic charge-induced failures
(Dielectric breakdown, Hot carrier effects, Electrical over-stress and
Electrostatic discharge), Environmental damage (moisture ingress,
corrosion, radiation damage), Degradation of interconnects (solder creep
6. Failure Analysis techniques: Non-destructive techniques – I-V trace,
Infrared, X-ray and Electroluminescence imagining, Destructive techniques-
chemical / thermal / mechanical decapsulation of electronic devices for
die-level failure analysis, materials analysis techniques – FTIR, EDX.
7. Special topics: Design for reliability, degradation in photovoltaic
(PV) modules, systems reliability.
1. M. Ohring, Reliability and Failure of Electronic Materials and Devices,
First Edition, Academic Press, 1998.
2. J.W. McPherson, Reliability Physics and Engineering, Second Edition,
3. J.Ross, Microelectronic Failure Analysis, Sixth Edition, ASTM