Micro-Transfer-Printing is a demonstrated versatile micro-assembly technology developed for over ten years since originally conceived at the University of Illinois . Micro-Transfer-Printing involves the release, transfer and printing of an array of devices from their growth substrate to a different substrate in a massively parallel manner (i.e. thousands of devices per transfer) with a high degree of positioning accuracy (±1.5 µm), using an elastomeric stamp as the transfer element. X-Celeprint has demonstrated this technology in a wide range of diverse applications spanning from OLED and micro-LED displays to concentrated photovoltaics, storage and photonics [2, 3]. This technology provides an excellent solution to challenges involving the integration of III-V devices with silicon and other application specific substrates such as engineered substrates, flexible substrates and glass substrates. This paper presents recent advances in the fabrication of micro-assembled devices using micro-transfer printing. Processes to print micro-scale devices grown on different native substrates such as Silicon, Gallium Arsenide, Gallium Nitride and Indium Phosphide will be described. Recent advances in print yield, device pitch, print accuracy, array size, and number of devices transferred per print will be reported. The devices printed are micro-scale, less than 10um in thickness and less than 100um in lateral dimensions. We continue to make rapid progress in our ability to print smaller and smaller micro-components and this paper will discuss the current state of the art. Finally, we will identify new applications that leverage the integration of III-V devices with non-native substrates.  E. Menard, K. J. Lee, D. Y. Khang, R. G. Nuzzo, J. A. Rogers, Appl. Phys. Lett. 84, 5398 (2004)  C.A. Bower, M.A. Meitl, S. Bonafede, D. Gomez, A. Fecioru and D. Kneeburg, “Heterogeneous integration of microscale compound semiconductor devices by micro-transfer printing, IEEE Electronic Components and Technology Conference, p 963 (2015)  C.A. Bower, E. Menard, S. Bonafede, J.W. Hamer, R.S. Cok, “Transfer-printed microscale integrated circuits for high performance display backplanes,” IEEE Transactions on Components, Packaging and Manufacturing 1 (12), 1916-1922 (2011)
Kanchan Ghosal is the Director of Technology and Business Development at X-Celeprint Inc., where he is responsible for program management to commercialize micro-transfer printing. He was previously the Director of Technology of Semprius, a concentrated photovoltaics start-up that used micro-transfer printing to manufacture very high efficiency solar modules (>35% efficient). At Semprius, Dr. Ghosal was responsible for Product Applications, PV System Design and customer program management. He has also worked in technical roles at Texas Instruments and Cree. Kanchan has presented at many industry conferences including the 2016 Spring MRS Conference. He has a Ph.D. in Chemical Engineering from North Carolina State University.