Modular multilevel converter (MMC) is the most preferred high power converter technology solution. It offers numerous advantages such as modular and scalable structure, high efficiency, high reliability, and high quality output voltage. However, to withstand the full dc-link voltage, MMC with half bridge submodules (HBSMs), requires double the number of switching devices as compared to the two-level converter. Moreover, for high power applications it requires a large number of SMs, which leads to large number of capacitors requirement, increased footprint, complexity and initial investment significantly. It is also unable to limit or block the high fault current during the dc side fault events. This talk focuses on the study and development of new submodule (SM) structures, control schemes and improved converter topologies targeted to address the aforementioned keys issues of the MMC. The Hybrid multilevel converters using bidirectional thyristors and IGBTs have gained significant interests in recent times, as they possess important features of both voltage-source and line-commutated converter technologies. The second part of this talk focuses on this new high power converter technology solution.
Anshuman Shukla is a faculty member in the Department of Electrical Engineering at IIT Bombay since January 2011, where he is currently an Associate Professor. Prior to joining IIT Bombay, he was working with ABB Corporate Research Center in Sweden. His research interests include converter topologies and control for medium and high power applications, solid state transformers, hybrid and solid-state circuit breakers, and the application of SiC power electronics.