Chip technology has had a profound impact on the world, entering almost all facets of modern life. The catalyst for this has been the exponential growth in computing power ? roughly fifteen orders of magnitude over the past 100 years. The driving force for this change has been economics ? smaller features result in better performance and cost/function, which in turn leads to more applications and larger markets. Those economics and the requirements for technology scaling have both changed in a fundamental way over the past decade. Traditional CMOS scaling, which has driven device performance during the past several decades, is approaching atomistic and quantum-mechanical boundaries. Semiconductor R&D innovation has never been more critical for continuing the roadmap of technology scaling and improved power-performance. This requires long-term investment and collaboration in fundamental research. Dr. Patton's keynote talk will discuss these industry forces and describe the key elements in the technology roadmap that are needed to solve the significant challenges of continued technology scaling.
Dr. Gary Patton is Vice President of IBM?s Semiconductor Research and Development Center in East Fishkill, New York. He has responsibility for IBM?s semiconductor R&D roadmap, operations, and technology development alliances, with primary locations in East Fishkill, New York; Burlington, Vermont; Bangalore, India; and the Albany Nanotech Research Center in Albany, New York. His responsibilities include the development of IBM?s next generation SOI and Bulk CMOS logic and embedded DRAM technologies. During his career at IBM, Dr. Patton has held various management and executive positions in IBM?s Microelectronics, Storage Technology, and Research Divisions, including positions in technology and product development, manufacturing, and business line management. Dr. Patton received his B.S. degree in electrical engineering from UCLA and his M.S. and Ph.D. degrees in electrical engineering from Stanford University. He is also a Fellow of the IEEE.