Low Temperature Co-fired Ceramic (LTCC) is a glass-ceramic, multilayer circuit and electronic package preparation process that has great advantages over the other, more conventional electronic packaging technologies. This process allows very high interconnect density due to multilayer capability, can integrate passive components, handle very large numbers of Input –output (I/O) connections and at the same time has a capability to cater to high frequency (HF) circuit needs. Since two decades, High Frequency communications circuits have been the most exploited commercial application of LTCC. With recent focus on microsystems, focus has shifted on various innovative applications of LTCC, such as, microfluidics, microsensor and MEMS packaging, micro-actuators etc, opening applications in wide ranging fields, such as, aerospace and military, biomedical diagnostics, optoelectronics etc. Since the LTCC facility was set-up, C-MET has worked with every single research laboratory having applications in LTCC. As a result, wide ranging applications have been developed, which include, MEMS packaging, satellite communication circuits, sensor packaging, pressure sensors, cryocoolers, magnetic sensors, vacuum feedthrough, etc. C-MET has also developed standard, indigenous LTCC materials as also some innovative materials for buried passive components and integrated power source. The talk provides details of LTCC technology, applications and materials development at C-MET.
Girish Phatak did his MSc-Physics with Electronics as special subject at the Department of Physics, University of Pune. He completed his PhD in Microelectronics from the Dept of Electrical Engineering, IIT Bombay. Subsequently, he was a faculty at the Dept of Electronic Science, University of Pune and later in 1995, he joined C-MET. He received MONBUSHO fellowship from Govt. Japan and worked for his Post Doctoral Research at Nagoya University from 1998 to 1999. After his initial work in the area of thin films and Si based devices at IIT Bombay and University of Pune, he shifted to the area of Hybrid Micro Circuit (HMC) and Surface Mount Technology (SMT) materials, popularly known as Thick film materials. He has contributed to the development of paste families of Ag and Ag-Pd based conductor pastes, Birox based resistor pastes and solder pastes. The Solder paste technology has since been has been transferred to the Industry. About a decade ago, he took a major initiative in the area of Electronic Packaging, and has set up a facility for the fabrication of Low Temperature Co-fired Ceramic (LTCC) based ceramic circuits and packages, with help of generous support from the National Programme on Smart Materials (NPSM), and subsequently upgraded the facility with the help of funding from MeitY and NPMASS. He has undertaken and completed more than 25 projects from several research laboratories of DRDO, ISRO and DAE and a few private companies where he has contributed in development of special packages and circuits. In pursuit of completing the technology development in the country, he has also undertaken development of standard and futuristic LTCC materials. He has 40 research papers to his credits in renowned Journals and more than 100 contributions to International and National conferences. He has 4 book chapters to his credit. He is also guiding Research Students in the area of LTCC and Packaging Materials and Processes.