The presentation will outline the advantages of SiC over other power electronic materials, and introduce SiC devices currently developed for power applications. A brief market update will provide commercialization perspective. Device fabrication will be discussed with an emphasis on the processes that do not carry over from the mature Si manufacturing world and are thus tailored to SiC. In particular, the talk will stress SiC dry etching, high temperature implantation and post-implantation anneal, metallization, Ohmic contacts formation, and MOSFET SiC/SiO2 interface gate oxide specifics. Common Edge Termination techniques, which allow SiC devices to reach their full high-voltage potential, will be presented and their fabrication and impact on device performance will be highlighted.
Victor Veliadis received the five-year diploma degree from the National Technical University of Athens Greece in 1990, and the Masters and Ph.D. degrees from Johns Hopkins University in 1992 and 1995, respectively, all in Electrical and Computer Engineering. From 1996 to 2000, he was with start-up Nanocrystals Imaging Corporation where he developed quantum-dot phosphors for imaging applications. From 2000 to 2003, he was with Lucent Technologies where he designed InP-based tunable photonic integrated circuits for telecommunication applications. In 2003, Victor was Adjunct Physics Professor at Ursinus College and St. Joseph’s University where he taught quantum physics and oversaw the physics laboratories. After a brief military service, Victor joined Northrop Grumman Corp. in 2004 where he designed, fabricated, and tested SiC SITs, JFETs, MOSFETs, Thyristors, and JBS, Schottky, and PiN diodes in the 1-12 kV range. In 2016 Victor was appointed CTO, and in 2017 Deputy Executive Director and CTO of Power America, which is a U.S Department of Energy wide bandgap device Manufacturing Institute managed by North Carolina State University (NCSU). In 2016, Victor also became Professor in Electrical and Computer Engineering at NCSU. Victor has given over 60 invited presentations/keynotes/tutorials, authored/co-authored 108 peer-reviewed technical articles, authored 3 book chapters, and has 24 issued patents to his credit. He is an IEEE Fellow, an IEEE EDS Distinguished Lecturer, and has served in the ECSCRM, ICSCRM, WiPDA, and ISPSD technical and organizing committees.