The automotive semiconductor IC market is the most exciting and challenging market today because the recent advances in the areas of ADAS and infotainment need high performance Embedded Processors at low cost and with high reliability. In order to design a high performance, high reliability and low cost ICs it is important to incorporate system level electrical, thermal and mechanical constraints from the beginning of the design cycle. This means chip, package and board designers must therefore work in concert in order to optimize the design for the targeted application environment. In this talk I will give an overview of the Co-design process that allows us to optimize the chip, package and board designs to meet the design objectives of high performance, high reliability and low cost.
Snehamay Sinha is the Manager of the System Co-design team in the Processors Group at TI. He has a Ph.D. in Physics from the Tata Institute of Fundamental Research, Mumbai. He joined TI in 1996 and has worked in the areas of ESD/EM/GOI, substrate noise coupling and more recently on signal and power integrity analysis. He has four patents and has published multiple journal and conference papers.