Polymer composites, especially as those derived from fillers, have found ubiquitous use in microelectronics and packaging applications due to their high degree of property tunability and ease process integration, all being offered at low cost. A number of these approaches, which include nanofillers, block copolymer blends and interpenetrating polymer networks, can lead to an enhancement in certain desired properties with manageable property tradeoffs. This presentation will highlight some of the current challenges related to the use of polymers that are being faced in the microelectronics industry as well as the approaches being researched. These examples include: toughening of epoxy composites used in encapsulants and substrates, development of high thermal conductivity composites while maintaining optimal flow properties for thermal interface material applications, flow modeling of highly filled liquid composites thorough constrained geometries, and the use of block copolymers as a platform for soft lithography to enable a cost effective means of creating sub-30nm features.
Arjun Krishnan is a Sr. Packaging Engineer in the Assembly Test and Technology Development division at Intel Corporation, Chandler, AZ, USA. He received a B.Tech. degree in Chemical Engineering from IIT Madras (2005) and a Ph.D. degree in Chemical and Biomolecular Engineering (2010) from North Carolina State University, Raleigh, NC, USA. His Ph.D. dissertation research activities included the study of morphology, rheology and electroactive properties of block copolymer blends for use in biomimetic and tactile systems. He joined Intel in 2010, where his current research and development interests are devoted to polymer composites for microelectronic packaging applications. He has published over 15 research papers and 4 patent applications, his work has been featured on the cover of an international journal and received the Best Overall Poster Award at the MRS (Materials Research Society) Fall 2010 Meeting.