Facilities

Precise patterns in a clean environment form the backbone of any MEMS process flow. NMPF is equipped with a double side mask aligner, along with automated spin coaters and etching benches, all housed in a class 100 yellow clean room.

• Double Side Mask Aligner – Suss Microtech
  • Model: MA/BA6
  • TSA: 0.5 μm BSA: 1 μm
  • Exposure wavelength: UV400
• Spin Coaters – Laurell
  • Model: WS-650-23NPP
  • Automatic syringe injection

Thin films are essential for making electrical contacts, growing sacrificial layers or for encapsulation. Various thin-film coating solutions are available at NMPF.

• Multi target sputter – AJA International
  • Model no: ATC1800
  • Metals: Au, Ti, Pt, Cr
  • Dielectrics: HfO₂,SixNy, SiOx
• Parylene CVD – SCS
  • Model no: Labcoter 2 (PDS2010)
• LPCVD Furnaces – SVCS
  • Tube 1: SixNy
  • Tube 2: PolySi, Doped PolySi
  • Tube 3: Thermal oxidation
• Rapid Thermal Annealing – Annealsys
  • Model no: AS-One
  • Capabilities: Nitridation, oxidation, ohmic contact annealing

Apart from wet etch benches, NMPF offers both RIE and DRIE etch options for silicon processing.

• Deep Reactive Ion Etching – Samco
  • Model no: 400 iPB (Bosch process)
  • Max etch rate : 55 μm/min
  • High aspect ratio of upto 40:1
  • Upto 400 μm depth (aspect ratio 27:1)
• Oxygen Plasma Etch – Samco
  • Model no: RIE – 1C
  • Top load chamber, manual gas flow
  • Gases: O₂, CF₄ Wet Etch
• Chemical fume hoods
  • TMAH etching, metal etch, oxide etch

NMPF is equipped with wafer dicer and wire bonder, which will enable your MEMS prototype devices to be tested right out of the facility.

• Wire Bonder – TPT
  • Model no: HB16
  • With pick and place feature
• Wafer Dicer – ADT
  • Model no: 7122
  • Capable of multi-angle dicing

In addition to these, NMPF can arrange for any other complex characterizations you might require, through the state-of-art facilities housed at IIT Bombay Nanofabrication Facility.