INTERNATIONAL COLLABORATIONS
PAST/ONGOING INTERACTIONS/RESEARCH COLLABORATIONS:
(interactions that resulted in joint publications/projects/joint guidance of students)
- Centre for Materials & Microsystems (Fondazione Bruno Kessler), Trento (TN), Italy (Current)
- Max-Planck Institute for Polymer Research, Mainz, Germany (Current)
- McGill University, Quebec, Canada (Nano-mechanical sensors) (Current)
- University of Alberta, Alberta, Canada (Sensors) (Current)
- Georgia Insitute of Technology (Georgia Tech), Atlanta, USA (MEMS Packaging) (Current)
- Applied Materials Corporation, USA (Bottom-up Approaches for Nano-scale CMOS) (Current)
- Intel-(Circuit Research Lab) (high-k modeling, mixed-signal CMOS, Multi-gate MOSFETs) (Current)
- Intel Mobile Commuincations, Munich, Germany (Input-Output high voltage devices, Ultra low power devices) (Current)
- Tokyo Institute of Technology-Japan (Finfets) (Current)
- Nanyang Technological University-Singapore (Organic Electronics) (Current)
- University of Cambridge, UK (Sensors) (Current)
- National Engineering School of Sfax, Tunisia (Current)
- Universita della Calabria, Italy (High-k characterization for CMOS/Finfets) (2007-2010)
- Johannes Kepler Universitat Linz , Austria (Organic transistors) (2012-2014)
- IBM (Technology Aware Design Challenges) (2006-2014)
- IMEC-Belgium (Multi-gate MOSFETs) (2010-2014)
- University of Washington, USA (MEMS) (2008-2010)
- International Rectifier Corporaton (Super-junction Power MOSFETs) (2005-2007)
- National University of Singapore (High-k Dielectric Characterization) (2005-2008)
- University of California -Los Angeles (Single Halo MOSFETs & Mixed signal CMOS) (1998-2006)
- Yale University (JVD nitrides) (1999-2001)
- Universitaet der Bundeswehr Munich-Germany (Vertical transistors) (2000-2005)