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Fabrication facilities in the
Microelectronics Group include a Class 1000 Clean Room with a
full CMOS line including an electron-beam-lithography system:
The facilities include:
1. Several oxidation/diffusion furnaces
2. Low pressure and atmospheric pressure CVD furnaces
3. Mask aligner and photolithography
4. Reactive Ion Etch (RIE) System
5. Electron-Beam-Lithography system
6. Several vacuum evaporation systems
7. Plasma processing systems
8. Class 100 clean benches
9. Hot-Wire CVD system
10. Fabrication monitoring equipment like AFM, spectroscopic ellipsometer,surface profiling, 4-probe, etc.
11. Access to the institute facilities XRD, TEM, ESCA, etc. |
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