Journals

2023:

  • G. Avinash Reddy and A. Shukla, “The enhanced modular multilevel converter”, Accepted to appear in IEEE Trans. on Power Electronics, March, 2023.
  • M. S. Ansari, A. Shukla and H. J. Bahirat, “Analysis and design of mmc-based high power dc-dc converter with trapezoidal modulation”, IEEE Trans. on Power Electronics, vol. 38, no. 6, pp. 7256-7270, Feb. 2023.

2022:

  • M. S. Anari, I. C. Rath, S. K. Patro, A. Shukla and H. J. Bahirat “High power parallel hybrid dc-dc converter”, IEEE Trans. on Industry Applications, vol. 59, no. 1, pp. 1077-1089, Oct. 2022.
  • S. Belkhode, A. Shukla and S. Doolla, “A highly efficient Si/SiC-based hybrid active npc converter with a novel modulation scheme”, Accepted to appear in IEEE Trans. on Industry Applications, July 2022.
  • N. P. Rao and A. Shukla, “Analysis of capacitor voltage unbalance in hybrid MMC and its novel operation with reduced submodule capacitance”, Accepted to appear in IEEE Journal of Emerging and Selected Topics in Power Electronics, June 2022.
  • I. C. Rath, S. K. Patro and A. Shukla, “Parallel Hybrid Converter based STATCOM: Operating Principles and Capacitor Voltage Control Using Fundamental Frequency Zero-Sequence Voltage”, Accepted to appear in IEEE Trans. on Power Electronics, May 2022.
  • G. Avinash Reddy and A. Shukla, “The switched modular multilevel converter: a compact vsc for high and medium voltage applications”, Accepted to appear in IEEE Trans. on Power Delivery, Jan. 2022.

2021:

  • S. Belkhode, A. Shukla and S. Doolla, “Five-Level Hybrid Active-NPC H-bridge Converter with A Novel Space-Vector-Modulation Scheme”, Accepted to appear in IEEE Journal of Emerging and Selected Topics in Power Electronics, Dec., 2021.
  •  G. Avinash Reddy and A. Shukla, “Arm-current-sensorless circulating current control of MMC”, Accepted to appear in IEEE Trans. on Industrial Electronics, Oct. 2021.
  • V. K. Goyal and A. Shukla, “Two-stage Hybrid Isolated DC-DC Boost Converter for High Power and Wide Input Voltage Range Applications”, Accepted to appear in IEEE Trans. on Industrial Electronics, July 2021.
  • S. Belkhode, P. Rao, A. Shukla and S. Doolla, “Comparative evaluation of silicon and silicon-carbide devices-based MMC and NPC converter for medium voltage applications”, Accepted to appear in IEEE Journal of Emerging and Selected Topics in Power Electronics, Aug., 2021.
  • S. Belkhode, A. Shukla and S. Doolla, “Split-Output Hybrid Active Neutral-Point-clamped Converter for MV Applications”, Accepted to appear in IEEE Journal of Emerging and Selected Topics in Industrial Electronics, December, 2020.
  • I. C. Rath, S. K. Patro and A. Shukla, “Parallel Hybrid Converter based STATCOM and Capacitor Voltage Control Technique”, IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 9, no. 5, pp. 5597-5612, Oct. 2021.
  • V. K. Goyal and A. Shukla, “Isolated DC-DC Boost Converter for Wide Input Voltage Range and Wide Load Range Applications”, Accepted to appear in IEEE Trans. on Industrial Electronics, September, 2020.
  • S. K. Patro and A. Shukla, “Control and Derived Topologies of Parallel Hybrid Converter”, IEEE Trans. on Industry Applications, vol. 57, no. 1, pp. 598-613, Jan./Feb. 2021.
  • S. D. Joshi, M. B. Ghat, A. Shukla and M. C. Chandorkar, “Improved Balancing and Sensing of Submodule Capacitor Voltages In Modular Multilevel Converter”, IEEE Trans. on Industry Applications, vol. 57, no. 1, pp. 537-548, Jan./Feb. 2021.
  • S. Belkhode, A. Shukla and S. Doolla, “Enhanced Hybrid Active Neutral-Point-Clamped Converter with Optimized Loss Distribution-based Modulation Scheme”, IEEE Trans. on Power Electronics, vol. 36, no. 3, pp. 3600-3612, Mar. 2021.
  • M. B. Ghat, S. K. Patro and A. Shukla, “The Hybrid-Legs Bridge Converter: A Flexible and Compact VSC-HVDC Topology”, IEEE Trans. on Power Electronics, vol. 36, no. 3, pp. 2808-2822, Mar. 2021.

2020:

  • S. Belkhode, A. Shukla and S. Doolla, “Split-Output Hybrid Active Neutral-Point-clamped Converter for MV Applications”, Accepted to appear in IEEE Journal of Emerging and Selected Topics in Industrial Electronics, December, 2020.
  • I. C. Rath, S. K. Patro and A. Shukla, “Parallel Hybrid Converter based STATCOM and Capacitor Voltage Control Technique”, IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 9, no. 5, pp. 5597-5612, Oct. 2021.
  • V. K. Goyal and A. Shukla, “Isolated DC-DC Boost Converter for Wide Input Voltage Range and Wide Load Range Applications”, Accepted to appear in IEEE Trans. on Industrial Electronics, September, 2020.
  • S. K. Patro and A. Shukla, “Control and Derived Topologies of Parallel Hybrid Converter”, IEEE Trans. on Industry Applications, vol. 57, no. 1, pp. 598-613, Jan./Feb. 2021.
  • S. D. Joshi, M. B. Ghat, A. Shukla and M. C. Chandorkar, “Improved Balancing and Sensing of Submodule Capacitor Voltages In Modular Multilevel Converter”, IEEE Trans. on Industry Applications, vol. 57, no. 1, pp. 537-548, Jan./Feb. 2021.
  • S. Belkhode, A. Shukla and S. Doolla, “Enhanced Hybrid Active Neutral-Point-Clamped Converter with Optimized Loss Distribution-based Modulation Scheme”, IEEE Trans. on Power Electronics, vol. 36, no. 3, pp. 3600-3612, Mar. 2021.
  • M. B. Ghat, S. K. Patro and A. Shukla, “The Hybrid-Legs Bridge Converter: A Flexible and Compact VSC-HVDC Topology”, IEEE Trans. on Power Electronics, vol. 36, no. 3, pp. 2808-2822, Mar. 2021.
  • S. K. Patro and A. Shukla, “The Thyristor Augmented Modular Bridge Converter: A Highly Efficient VSC-HVDC Converter with Reduced Energy Storage Requirement”, Accepted to appear in IEEE Trans. on Power Delivery, June, 2020.
  • S. K. Patro and A. Shukla, “Modular directed series multilevel converter for hvdc applications”, IEEE Transactions on Industry Applications, vol. 56, no. 2, pp. 1618-1630, Mar/Apr. 2020.
  • S. K. Patro and A. Shukla, “Highly efficient fault-tolerant modular embedded thyristor directed converter for hvdc applications”, IEEE Transactions on Power Delivery, vol. 35, no. 1, pp. 349-363, Feb. 2020.
  • G. Avinash Reddy and A. Shukla, “Circulating current optimization control of MMC”, Accepted to appear in IEEE Trans. on Industrial Electronics, March 2020.
  • P. Bakas, Y. Okazaki, A. Shukla, S. K. Patro, K. Ilves, F. R. Dijkhuized and A. Nami, “Review of Hybrid Multilevel Converter Topologies Utilizing Thyristors for HVDC Applications”, Accepted to appear in IEEE Trans. on Power Electronics, May 2020.

2019:

  • S. K. Patro and A. Shukla, “Enhanced parallel hybrid converter with dc ripple minimization control”, Accepted to appear in IEEE Trans. on Industrial Electronics, Nov. 2019.
  • S. K. Patro, M. B. Ghat and A. Shukla, “Hybrid series converter: a dc fault tolerant hvdc converter with wide operating range”, Accepted to appear in IEEE Journal of Emerging and Selected Topics on Power Electronics, Dec. 2019.

2018:

  • M. B. Ghat and A. Shukla, “A new H-bridge hybrid modular converter (HBHMC) for hvdc application: operating modes, control and voltage balancing”, IEEE Transactions on Power Electronics, vol. 33, no. 8, pp. 6537-6554, Aug. 2018.
  • J. Venkat, A. Shukla and S. V. Kulkarni, “Flexible Power Electronic Converters for Producing AC Superimposed DC (ACsDC) Voltages “, IEEE Transactions on Industrial Electronics, vol. 65, no. 4, pp. 3145-3156, April 2018.

2017:

  • A. Kadam and A. Shukla, “A Multilevel Transformerless Inverter employing Ground Connection between PV Negative Terminal and Grid Neutral point”, IEEE Transactions on Industrial Electronics, vol. 64, no. 11, pp. 8897-8907, Nov. 2017.
  • M. Ghat, A. Shukla and R. Mishra, “Variable Slope Trapezoidal Reference Signal based Control for a dc Fault Tolerant Hybrid Modular Multilevel Converter with Cascaded Full Bridges”, IEEE Transactions on Industry Applications, vol. 53, no. 4, pp. 3770-3781, July/Aug. 2017.
  • J. Venkat, A. Shukla and G. Demetriades, “Dual-Transformer based Asymmetrical Triple-Port Active Bridge (DT-ATAB) Isolated DC-DC Converter”,”, IEEE Transactions on Industrial Electronics, vol. 64, no. 6, pp. 4549-4560, June 2017.
  • S. D. Joshi, M. C. Chandorkar and A. Shukla, “Pre-charging of module capacitors of MMC when the module switches are driven by a source derived from the module capacitor”, Sadhana Journal, Indian Academy of Sciences, Springer India, vol. 42, no. 8, pp. 1251-1262, Aug. 2017.
  • M. Bhesaniya and A. Shukla, “Norton Equivalent Modeling of Current Source MMC and Its Use for Dynamic Studies of Back-to-Back Converter System”, IEEE Transactions on Power Delivery, vol. 32, no. 4, pp. 1935-1945, Aug. 2017.

2016:

  • J. Venkat, A. Shukla and G. Demetriades, “Three-winding transformer based asymmetrical dual active bridge converter”, IET Journal of Power Electronics, vol. 9, no. 12, pp. 2377-2386, Oct. 2016.
  • E. C. Mathew, M. Ghat and A. Shukla, “A generalized cross-connected submodule structure for hybrid multilevel converters”, IEEE Transactions on Industry Applications, vol. 52, no. 4, pp. 3159-3170, Jul./Aug. 2016.
  • M. Bhesaniya and A. Shukla, “Current Source Modular Multilevel Converter: Detailed Analysis and STATCOM Application”, IEEE Trans. on Power Delivery, vol. 31, no. 1, pp. 323-333, Feb. 2016.
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