Department of Electrical Engineering, IIT Bombay
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Growth - MBE - III-V, T2SL
Fabrication - ICPRIE
Fabrication - Thermal Evaporator - indium
Fabrication - six target ebeam evaporator
Packaging - Dicer
Packaging - Flip Chip Bonder
Characterization - PL
Characterization - Hall measurement
Characeterization - DLTS
Characterization - IV, Noise measurement
Characterization - Spectral response
Characterization - Responsivity measurement
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