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EE701 Postgraduate

Introduction to MEMS

Credits
6
Type
Theory
Lecture
6 hr
Half sem
No

Course Content

Historical Background: Silicon Pressure sensors, Micromachining, MicroElectroMechanical Systems. Microfabrication and Micromachining : Integrated Circuit Processes, Bulk Micromachining : Isotropic Etching and Anisotropic Etching, Wafer Bonding, High Aspect-Ratio Processes (LIGA) Physical Microsensors: Classification of physical sensors, Integrated, Intelligent, or Smart sensors, Sensor Principles and Examples: Thermal sensors, Electrical Sensors, Mechanical Sensors, Chemical and Biosensors. Microactuators: Electromagnetic and Thermal microactuation, Mechanical design of microactuators, Microactuator examples, microvalves, micropumps, micromotors Microactuator systems : Success Stories, Ink-Jet printer heads, Micro-mirror TV Projector. Surface Micromaching : One or two sacrificial layer processes, Surface micromachining requirements, Polysilicon surface micromachining, Other compatible materials, Silicon Dioxide, Silicon, Micromotors, Gear trains, Mechanisms. Application Areas: All- mechanical miniature devices, 3-D electromagnetic actuators and sensors, RF/Electronics devices, Optical/Photonic devices, Mecical devices e.g DNA chip, micro-arrays. Lab/Design: (two groups will work on one of the following design project as a part of the course) RF/Electronics device/system, Optical/Photonic device/system, Medical device e.g. DNA-chip, micro-arrays.

Text / References

  1. 1 267011Stephen D. Senturia, Microsystem Design, Kluwer Academic Publishers, 2001.267011Marc Madou, Fundamentals of Microfabrication, CRC Press, 1997.267011Gregory Kovacs, Micromachined Transducers Sourcebook, WCB McGraw-Hill, Boston, 1998.267011M-H. Bao, Elsevier, Micromechanical Transducers: Pressure sensors, accelerometers, and gyroscopes, New York, 2000.