Microsystems: Analysis and Design

Module 1: Fabrication Introduction to IC fabrication, bulk and surface micromachining, scaling in micro-electro-mechanical systems (MEMS) Module 2: Beam analysis Analysis of MEMS structural design: Hookes law, beam theory, cantilever analysis, plate theory, spring (folded flexure) design, matrix analysis Module 3: Electrostatics Capacitive transduction, electrical equivalent circuit, pull-in instability, variable gap and comb-drive transducer, capacitive sensing configurations, displacement and velocity sensing, AC modulated sensing, square wave excitation, switched capacitor circuits Module 4: Practical aspects I Resonator dynamics (damping, dynamic vs static elasticity, nonlinearity, noise) Module 5: Practical aspects II Resonator testing (test configurations, de-embedding in capacitive transduction, RF MEMS testing), piezoelectric transduction, other transducers Module 6: Applications Inertial sensors, bulk acoustic resonators and applications, pressure sensors and microphones Course project: The course project may focus on one or more of following aspects: Process technology; Electro-mechanical design/analysis; Transducer system design/analysis; Modeling strategies; Application of MEMS devices