- Background and Introduction: Definitions of reliability, failure modes, mechanisms, cost of warranty returns, motivation for improving product reliability in the era of ‘Planned Obsolescence’.
- Introduction to mathematical methods for reliability: Failure rates, Normal distribution function, Six Sigma, Exponential, Weibull and Lognormal distributions for reliability modeling. Manufacturing yields.
- Accelerated testing: Types of accelerated tests, Designing accelerated tests for typical stressors experienced in field, Acceleration factors, Arrhenius, Eyring and modified Coffin-Manson models.
- Introduction to semiconductor device packaging: Materials and processes used for semiconductor device packaging, stresses induced because of packaging.
- Physics of failure – based models for: Mass transport-induced failures (electromiration and stress voiding), Electronic charge-induced failures (Dielectric breakdown, Hot carrier effects, Electrical over-stress and Electrostatic discharge), Environmental damage (moisture ingress, corrosion, radiation damage), Degradation of interconnects (solder creep and fatigue).
- Failure Analysis techniques: Non-destructive techniques – I-V trace, Infrared, X-ray and Electroluminescence imagining, Destructive techniques- chemical / thermal / mechanical decapsulation of electronic devices for die-level failure analysis, materials analysis techniques – FTIR, EDX.
- Special topics: Design for reliability, degradation in photovoltaic (PV) modules, systems reliability.
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