Module 1: Fabrication Introduction to IC fabrication, bulk and surface micromachining, scaling in microelectromechanical systems (MEMS)

Module 2: Beam analysis Analysis of MEMS structural design: Hooke’s law, beam theory, cantilever analysis, plate theory, spring (folded flexure) design, matrix analysis

Module 3: Electrostatics Capacitive transduction, electrical equivalent circuit, pull-in instability, variable gap and comb drive transducer, capacitive sensing configurations, displacement and velocity sensing, AC modulated sensing, square wave excitation, switched capacitor circuits

Module 4: Practical aspects I Resonator dynamics (damping, dynamic vs static elasticity, non-linearity, noise)

Module 5: Practical aspects II Resonator testing (test configurations, de-embedding in capacitive transduction, RF MEMS testing), piezoelectric transduction, other transducers

Module 6: Applications Inertial sensors, bulk acoustic resonators and applications, pressure sensors and microphones

Course project: The course project may focus on one or more of the following aspects: Process technology; Electromechanical design/analysis; Transducer system design/analysis; Modeling strategies; Application of
MEMS devices